高密度互連任意層HDI板產品

文章來源：作者：龔愛清查看手機網址

掃一掃！

掃一掃!

人氣：6664發布日期：2017-01-07 11:16【大中小】

HDI板產品信息

所有層為交錯與堆疊式銅填充激光通孔

每面高達14層，6層為高密度互連積層

無鹵素基材料 (中等至高等TG)=

鍍邊技術，保護空間優化與組裝

技術數據單

Capabilities	Standard Production	Advanced Production
Layer Count / Technology	4 - 12 Layers	4 - 14 Layers
PCB Thickness Range	0,3- 1,2 mm	0,3 - 1,4 mm
Build up Technology	ANY LAYER Microvias copper filled	ANY LAYER Microvias copper filled
Min. Laser drill Diameter	110 µm	80 µm
Laser Technology	CO2 direct drilling (UV/CO2)	CO2 direct drilling (UV/CO2)
Materials	FR4 / FR4 halogen reduced	FR4 / FR4 halogen reduced
Glass Transition Temperature	105°C / 140°C / 170°C	105°C / 140°C / 170°C
Standard glass cloth	106 / 1080 / 2116 / 1501 / 7628	1037 / 106 / 1080 / 2116 / 1501 / 7628
Copper thickness	12 µm / 18µm	9µm / 12µm / 18µm
Copper Plating Holes	20 µm (25 µm)	13 µm / 20 µm / 25 µm
Min. Line / Spacing	75µm / 75µm	50µm / 50µm
Soldermask Registration	+/- 38 µm (Photoimageable)	+/- 25 µm (Photoimageable)
Min. Soldermask Dam	70 µm	60 µm
Soldermask Color	green / white / black / red / blue	green / white / black / red / blue
Max. PCB Size	575 mm x 500 mm	575 mm x 500 mm
Production Panel	609,6 mm x 530 mm 609,6 mm x 457,2 mm	609,6 mm x 530 mm 609,6 mm x 457,2 mm
Min. Annular Ring	125 µm	100 µm
smallest drill	0,28 mm	0,15 mm
smalles Routing bit	0,8 mm	0,8 mm
Surfaces	OSP / HAL Lead Free / Immersion Tin Immersion NI/AU Plated Ni/Au Immersion Ag	OSP / HAL Lead Free / Immersion Tin Immersion NI/AU Plated Ni/Au Immersion Ag
Scoring	Yes	Yes
ID print	White	White
Blue Mask & Carbon print	Yes	Yes